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SMDSWLF.006 50G
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Mfr. Part Number
SMDSWLF.006 50G
Manufacturer
Chip Quik, Inc.
Datasheet
Description
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
RoHS Status
Lead Free / RoHS Complaint
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SMDSWLF.006 50G
Chip Quik, Inc.
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SMDSWLF.006 50G
Chip Quik, Inc.
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Specifications
Product Description
Purchase & Inquiry
Type
Wire Solder
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.006" (0.15mm)
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean, Water Soluble
Wire Gauge
34 AWG, 38 SWG
Mesh Type
-
Process
Lead Free
Form
Spool, 1.76 oz (50g)
Shelf Life
-
Shelf Life Start
-
Storage/Refrigeration Temperature
-
Brand Introduction

Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards. Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs. Their expertise in electronic rework, repair, and prototyping enables them to meet the needs of the industry through continuous development of products and methods.

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