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BGA0035-S
BGA-196 STAINLESS STEEL STENCIL
Mfr. Part Number
BGA0035-S
Manufacturer
Chip Quik, Inc.
Datasheet
Description
BGA-196 STAINLESS STEEL STENCIL
RoHS Status
Lead Free / RoHS Complaint
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BGA0035-S
Chip Quik, Inc.
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BGA0035-S
Chip Quik, Inc.
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Specifications
Product Description
Purchase & Inquiry
Type
BGA
Number of Positions
196
Pitch
0.020" (0.50mm)
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension
0.551" L x 0.551" W (14.00mm x 14.00mm)
Thermal Center Pad
-
Material
Stainless Steel
Brand Introduction

Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards. Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs. Their expertise in electronic rework, repair, and prototyping enables them to meet the needs of the industry through continuous development of products and methods.

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