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PA0032
TSSOP-8 TO DIP-8 SMT ADAPTER
Mfr. Part Number
PA0032
Manufacturer
Chip Quik, Inc.
Datasheet
Description
TSSOP-8 TO DIP-8 SMT ADAPTER
RoHS Status
Lead Free / RoHS Complaint
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PA0032
Chip Quik, Inc.
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PA0032
Chip Quik, Inc.
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Specifications
Product Description
Purchase & Inquiry
Proto Board Type
SMD to DIP
Package Accepted
TSSOP
Number of Positions
8
Pitch
0.026" (0.65mm)
Board Thickness
0.062" (1.57mm) 1/16"
Material
FR4 Epoxy Glass
Size / Dimension
0.700" x 0.400" (17.78mm x 10.16mm)
Brand Introduction

Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards. Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs. Their expertise in electronic rework, repair, and prototyping enables them to meet the needs of the industry through continuous development of products and methods.

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