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LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Mfr. Part Number
LTN20069
Manufacturer
Wakefield Thermal
Datasheet
Description
HEAT SINK BGA/PGA 16.5X16.5X8.9
RoHS Status
Lead Free / RoHS Complaint
sample
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LTN20069
Wakefield Thermal
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LTN20069
Wakefield Thermal
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Specifications
Product Description
Purchase & Inquiry
Type
Board Level
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Fins
Length
0.650" (16.51mm)
Width
0.653" (16.59mm)
Diameter
-
Fin Height
0.350" (8.89mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
8.00°C/W @ 500 LFM
Thermal Resistance @ Natural
-
Material
Aluminum
Material Finish
Black Anodized
Brand Introduction

Established in 1957, Wakefield Engineering designs efficient, affordable and reliable thermal management solutions for a diverse range of commercial, industrial, and military markets. Recognized as a worldwide leader, Wakefield Engineering has grown with the market while expanding into others, responding to technological advances and anticipating industry demands. Wakefield Engineering is a wholly owned subsidiary of Alpha Technologies Group, Inc.

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