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TC3-10G
HEAT SINK THERMAL COMPOUND
Mfr. Part Number
TC3-10G
Manufacturer
Chip Quik, Inc.
Datasheet
Description
HEAT SINK THERMAL COMPOUND
RoHS Status
Lead Free / RoHS Complaint
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TC3-10G
Chip Quik, Inc.
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TC3-10G
Chip Quik, Inc.
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Specifications
Product Description
Purchase & Inquiry
Type
Silicone Compound
Size / Dimension
10 gram Syringe
Usable Temperature Range
-40°F ~ 302°F (-40°C ~ 150°C)
Color
Gray
Thermal Conductivity
8.50W/m-K
Features
-
Shelf Life
60 Months
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Brand Introduction

Chip Quik®, Inc. is the manufacturer of the new patented Chip Quik® SMD removal kit. This innovative method of removing SMD's (surface mounted devices) at a safe low temperature has revolutionized the printed circuit board rework industry.

Chip Quik®, along with its partner Proto Advantage offers solder paste, solder wire, tacky flux, removal kits, SMT to DIP adapters, SMT to SIP adapters, and breadboards. Chip Quik and Proto Advantage can now meet all of your rework and prototyping needs. Their expertise in electronic rework, repair, and prototyping enables them to meet the needs of the industry through continuous development of products and methods.

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