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208-7391-55-1902
CONN SOCKET SOIC 8POS GOLD
Mfr. Part Number
208-7391-55-1902
Manufacturer
3M
Datasheet
Description
CONN SOCKET SOIC 8POS GOLD
RoHS Status
Lead Free / RoHS Complaint
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208-7391-55-1902
3M
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208-7391-55-1902
3M
*Quantity:
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Please send RFQ, we will response immediately
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Specifications
Product Description
Purchase & Inquiry
Type
SOIC
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
-
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Closed Frame
Termination
Solder
Pitch - Post
-
Contact Finish - Post
Gold
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polyethersulfone (PES), Glass Filled
Operating Temperature
-55°C ~ 150°C
Brand Introduction

3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M™ Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak™ High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX™ and SLA modeling - 3M's experienced engineers turn ideas into real world solutions.

3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool™ Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.

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