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08-3518-00
CONN IC DIP SOCKET 8POS GOLD
Mfr. Part Number
08-3518-00
Manufacturer
Aries Electronics, Inc.
Datasheet
Description
CONN IC DIP SOCKET 8POS GOLD
RoHS Status
Lead Free / RoHS Complaint
sample
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08-3518-00
Aries Electronics, Inc.
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08-3518-00
Aries Electronics, Inc.
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Specifications
Product Description
Purchase & Inquiry
Type
DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
8 (2 x 4)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Surface Mount
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Tin
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-
Brand Introduction

Aries is the recognized leading manufacturer of Zero Insertion Force (ZIF) Test Sockets for DIP, PGA, PLCC and SOIC sockets, and continues to be a significant source for a wide variety of specialty electronic connectors. Their corporate objective is to continue to grow within the electronic packaging area, further establishing their position as a major international connector manufacturer.

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