Optical Sensors - Image Sensors, Camera
Products in the image sensor and camera family are component or module-level devices used to electronically capture visual information in the visible and/or infrared spectrums. Consisting of an array of photosensitive elements connected to a shared control and interface mechanism, available products include those adapted to common still image and video capture as well as more specialized applications such as thermal and spatial imaging.
Product List
Total Components: 100
| Product | Pricing | Datasheet | Type | Pixel Size | Active Pixel Array | Frames per Second | Voltage - Supply | Package / Case | Supplier Device Package | Operating Temperature | Stock & Quantity |
|---|---|---|---|---|---|---|---|---|---|---|---|
 DEV-16260 SparkFun | 1 $36.8800 | Datasheet | - | 1.12µm x 1.12µm | 3280H x 2464V | - | 1.08V ~ 3V | Module | - | -20°C ~ 60°C | 6,324 Cart + RFQ |
 TR-EVO-MINI-I2C Terabee | 1 $41.8000 | Datasheet | 3D Time of Flight | - | - | - | 4.75V ~ 5.25V | Module | - | -20°C ~ 75°C | 2,832 Cart + RFQ |
 TR-EVO-MINI-USB Terabee | 1 $41.8000 | Datasheet | 3D Time of Flight | - | - | - | 4.75V ~ 5.25V | Module | - | -20°C ~ 75°C | 3,186 Cart + RFQ |
 TR-EVO-3M-USB Terabee | 1 $64.0000 | Datasheet | 3D Time of Flight | - | - | 100 | 4.75V ~ 5.25V | Module | - | - | 6,435 Cart + RFQ |
 MLX90640ESF-BAB-000-SP Melexis | 1 $66.1900 | Datasheet | Thermal | - | 32H x 24V | - | 2.9V ~ 3.6V | TO-39-4 Metal Can | TO-39 | -40°C ~ 85°C | 3,618 Cart + RFQ |
 MLX90640ESF-BAA-000-SP Melexis | 1 $72.5500 | Datasheet | Thermal | - | 32H x 24V | - | 2.9V ~ 3.6V | TO-39-4 Metal Can | TO-39 | -40°C ~ 85°C | 6,786 Cart + RFQ |
 TR-EVO-64PX-USB Terabee | 1 $149.0000 | Datasheet | 3D Time of Flight | - | - | 130 | 4.75V ~ 5.25V | Module | - | - | 4,074 Cart + RFQ |
 AR1335CSSC11SMKA0-CP2 onsemi | 1 $29.4000 | Datasheet | CMOS | 1.1µm x 1.1µm | 4208H x 3120V | 30 | - | 63-WFBGA, CSPBGA | 63-ODCSP (6.29x5.69) | - | 8,014 Cart + RFQ |
 S306SP Seek Thermal | 1 $795.9000 | Datasheet | Thermal | 12µm x 12µm | 320H x 240V | 9 | 3.3V ~ 5V | Module | Module | -10°C ~ 60°C | 8,847 Cart + RFQ |
 MS202SP Seek Thermal | 1 $795.9000 | Datasheet | Thermal | 12µm x 12µm | 200H x 150V | 9 | 3.3V ~ 5V | Module | Module | 0°C ~ 65°C | 1,195 Cart + RFQ |
MS201SP Seek Thermal | 1 $795.9000 | Datasheet | Thermal | 12µm x 12µm | 200H x 150V | 9 | 3.3V ~ 5V | Module | Module | 0°C ~ 65°C | 5,436 Cart + RFQ |
 AR0330CS1C12SPKA0-CP2 onsemi | 1 $25.2000 | Datasheet | CMOS | 2.2µm x 2.2µm | 2304H x 1536V | 30 | 1.7V ~ 1.9V, 2.7V ~ 2.9V | 61-WFBGA, CSPBGA | 61-ODCSP (6.28x6.65) | -30°C ~ 70°C (TJ) | 4,595 Cart + RFQ |
 AR0238CSSC12SHRA0-DP2 onsemi | 1 $25.2000 | Datasheet | CMOS | 3µm x 3µm | 1928H x 1088V | 60 | 1.7V ~ 1.95V, 2.5V ~ 3.1V | 48-PLCC | 48-PLCC (11.43x11.43) | -30°C ~ 85°C (TJ) | 5,668 Cart + RFQ |
 AR0144CSSC00SUKA0-CPBR2 onsemi | 1 $27.3000 | Datasheet | CMOS | 3µm x 3µm | 1280H x 800V | 60 | - | 69-WFBGA, CSPBGA | 69-ODCSP (5.55x5.57) | - | 4,554 Cart + RFQ |
 NOIV1SN1300A-QDC onsemi | 1 $162.5600 | Datasheet | CMOS | 4.8µm x 4.8µm | 1280H x 1024V | 150 | 1.8V, 3.3V | 48-LCC | 48-LCC (14.22x14.22) | -40°C ~ 85°C (TJ) | 4,765 Cart + RFQ |
 PPROMCAMQ Banner Engineering | 1 $1.0000 | Datasheet | - | 6µm x 6µm | 752H x 480V | 48 | - | Module | - | 0°C ~ 50°C | 9,166 Cart + RFQ |
 NOII4SM6600A-QDC onsemi | 1 $264.0000 | Datasheet | CMOS | 3.5µm x 3.5µm | 2210H x 3002V | 5 | 2.5V, 3.3V | 68-LCC | 68-LCC (24.13x24.13) | -30°C ~ 65°C (TJ) | 3,534 Cart + RFQ |
 MIRA030-1RM2WP ams | 1 $17.0600 | Datasheet | CMOS | 3.744µm x 3.744µm | 640H x 480V | 180 | 1.4V ~ 1.6V | 32-WFBGA, WLCSP | 32-CSP (3.70x3.07) | -30°C ~ 85°C (TA) | 7,173 Cart + RFQ |
 UPD8873CY-A Intersil (Renesas Electronics Corporation) | 1 $11.9800 | Datasheet | - | - | - | - | - | - | - | - | 6,264 Cart + RFQ |
 AR0140CS2C00SUEA0 onsemi | 1 $13.6700 | Datasheet | CMOS | 3µm x 3µm | 1280H x 800V | 45 | 1.8V, 2.8V | 48-CLCC | 48-CLCC | - | 8,800 Cart + RFQ |