PCIE: Revolutionizing High-Speed Data Transfer in Electronics

Microprocessors: Driving Electronics Innovation

UART: Future-Ready Serial Data Transmission Interface

NAND Flash Industry Revenue Declines as Buyers Remain Cautious

Samsung Display Unveils Revolutionary OLED Technologies at Display Week 2023

Market Shift: Digital Potentiometers Replace Rheostats in Electronics

TSMC Wins Big AI Chip Orders from NVIDIA with Sub-7nm Process

Intel Reveals Future AI Strategy and GPU Advancements at Hamburg Exhibition

Sharp Exits iPhone 16 Camera Module Supply Chain

Apple Books 90% of TSMC's 3nm Process for Future Devices

Semiconductor Giants Partner with Imec to Reduce IC Manufacturing's Environmental Impact

Samsung Unveils Enhanced Next-Gen DRAM for AI and ML Applications

Infineon Introduces Advanced EiceDRIVER™ Gate Driver ICs

Infineon Launches CoolSiC Power Modules for Greener and Quieter Trains in Traction Applications

Apple Falls Behind in Lucrative Foldable Smartphone Market as Google Unveils Pixel Fold

Onsemi Introduces Advanced 1200V EliteSiC SiC M3S Devices

Intel Announces 10% Budget Cut and Potential 20% Layoffs as Market Challenges Persist

Samsung Electronics Boosts 4nm Chip Yield, Secures Collaborations and Rebuilds Trust

TSMC Faces Higher Costs for Overseas Chip Factories, May Lead to Increased Prices for Outsourced Manufacturing

Samsung's Delay in Testing Korean-Made Photomask Films Surprises Industry, Despite Investment in S&S Tech and FST

OpenAI, Creator of ChatGPT, Completes $300 Million Stock Sale to Venture Capital Firms, Valued at $27-29 Billion

Cadence Announces Successful Tape-out of Its Advanced Packaging IP Based on TSMC's 3nm Process Technology

STMicroelectronics Launches STLINK-V3PWR for Accurate Power Measurement in IoT and Wireless Applications

Nexperia Unveils High-Performance 650V SiC Schottky Diode for Power Applications